Overview
Main description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Table of contents
PREFACEChapter 1: Engineering Fundamentals of MEMS and MOEMS Electronic Packaging1.1: The Package as the Vital Bridge1.2: Packaging Challenges1.3: Multiple Functions1.4: Package Types1.5: Reliability and Qualification1.6: SummaryChapter 2: Principles, Materials, and Fabrication of MEMS and MOEMS Devices2.1: Definitions and Classifications2.2: Basic Principles2.3: Sensing2.4: MEMS Sensor Principles2.5: Motion Actuation2.6: MEMS "Engines"2.7: CAD Structure Library; Building Blocks2.8: MEMS Devices2.9: Optical-MEMS; MOEMS2.10: Intelligent MEMS2.11: MEMS Applications2.12: MOEMS Devices -- MEMS Plus Light2.13: SummaryChapter 3: MEMS and MOEMS Packaging Challenges and Strategies3.1: Product-Specific Character of MEMS Packaging3.2: MEMS General Packaging Requirements3.3: Hermeticity: Levels, Evaluation Methods, and Requirements: Perceived vs. Actual3.4: Cost versus Performance Tradeoffs3.5: Emergence of Low-Cost Near-Hermetic Packaging3.6: Manufacturing Process Comparisons3.7: The Packaging MOEMS (Optical-MEMS) -- Additional Requirements3.8: Packages for Materials Handling3.9: NHP Beyond MEMSChapter 4: MEMS Packaging Processes4.1: Release Step4.2: Singulation: Sawing and Protection4.3: Capping Approaches4.4: Die Attach4.5: Wire Bonding4.6: Flip Chip Methods4.7: Tape Automated Bonding (TAB)4.8: Selective Underfill and Encapsulation4.9: Lid Sealing4.10: Antistiction Processes4.11: In-Process Handling4.12: Applying In-Package Additives4.13: Equipment4.14: Testing4.15: Reliability4.16: Selecting the Right MEMS/MOEMS Package and Materials4.17: Conclusions and SummaryChapter 5: MEMS Packaging Materials5.1: The Process Determines the Materials5.2: Joining Materials5.3: Assembly Issues and Material Solutions5.4: In-Package Additives5.5: ConclusionsChapter 6: From MEMS and MOEMS to Nano Technology6.1: Definitions are Important6.2: Combining Nano and MEMS6.3: Packaging Nano6.4: Summary, Conclusions and the FutureBibliographyIndex
Author comments
Ken Gilleo, Ph.D., is the CEO of ET-Trends, a consulting, packaging design, and IP firm specializing in emerging technologies. The firm’s projects include novel materials and packages and processes for MEMS, MOEMS, and optoelectronics. Dr. Gilleo is a member of IEEE and IMAPS, and he is also Vice President of Technical Programs for the Surface Mount Technology Association (SMTA). He has been actively involved in the development of new products for 30 years and is an inventor in circuitry, electronics materials, and packaging. Dr. Gilleo has 30 U.S. patents, and his products have received three R&D 100 Awards. Dr. Gilleo resides in Warwick, Rhode Island.
Back cover copy
AUTHORITATIVE, COST-EFFECTIVE SOLUTIONS FOR MEMS AND MOEMS ASSEMBLIES
This is a rigorous examination of design concepts, fabrication processes, and properties of materials used in MEMS and MOEMS package construction and assembly, detailing routing, electrical performance, thermal management, hermeticity level, and reliability. The author also describes advanced packaging methods, including:
- Wafer-level packaging
- Microfluidic device packaging
- Optical MEMS packaging
- RF and microwave packaging
- Laser sealing
Readers will find in-depth coverage of assembly technology and manufacturability, including cost issues.
CONTENT THAT SOLVES MEMS AND MOEMS PACKAGING & ASSEMBLY PROBLEMS:
- Engineering fundamentals of packaging for MEMS and MOEMS devices
- Principles, materials, and fabrication of MEMS and MOEMS devices
- Evaluation methods for MEMS and MOEMS packaging challenges
- MEMS packaging processes
- From MEMS and MOEMS to nanotechnology
