Overview
Table of contents
Chapter 1. Introduction – Matt Nowak (Qualcomm, USA); Chapter 2. Design challenges – Xiaopeng Xu (Synopsys, USA); Chapter 3. Process sequence integration – John Dukovic and Sesh Ramaswami(Applied Materials, USA); Chapter 4. TSV etch - Banqiu Wu and Ajay Kumar(Applied Materials, USA); Chapter 5. Chemical vapor deposition – Ajay Bhatnagar and Naga Rajgopal (Applied Materials, USA); Chapter 6. Barrier/ Seed Deposition - Zhitao Cao (Applied Maetrials, USA); Chapter 7. ECD fill – Tom Ritzdorf (Semitool, USA); Chapter 8. Chemical mechanical polishing – Yuchun Wang (Applied Materials, USA); Chapter 8. Wafer Thinning - Scott Sullivan (Disco, USA); Chapter 9. Temporary and permanent bonding - Markus Wiplinger, EVG, Austria)Chapter 10. Cost of Ownership – Paul Siblerud and Sesh Ramaswami(Semitool, USA; Applied Materials, USA)
Author comments
Banqiu Wu is Chief Technology Officer, TSV and Mask Products Division, Applied Materials, Inc. He has sound knowledge of TSV etch technology and has expert-level, hands-on plasma etch experience. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored two books: Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds several patents and awards.
Ajay Kumar is general manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals and holds more than 100 US patents. Dr. Kumar co-authored Extreme Ultraviolet Lithography.
Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.
